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| 1. general description the tja1054 is the interface between the protocol controller and the physical bus wires in a controller area network (can). it is primarily intended for low-speed applications up to 125 kbd in passenger cars. the device provides differential receive and transmit capability but will switch to single-wire transmitter and/or receiver in error conditions. the tja1054t is pin and downwards compatible with the pca82c252t and the tja1053t. this means that these two devices can be replaced by the tja1054t with retention of all functions. the most important improvements of the tja1054 with respect to the pca82c252 and tja1053 are: ? very low eme due to a very good matching of the canl and canh output signals ? good emi, especially in low power modes ? full wake-up capability during bus failures ? extended bus failure management including short-circuit of the canh bus line to v cc ? support for easy system fault diagnosis ? two-edge sensitive wake-up input signal via pin w ake 2. features 2.1 optimized for in-car low-speed communication n baud rate up to 125 kbd n up to 32 nodes can be connected n supports unshielded bus wires n very low electromagnetic emission (eme) due to built-in slope control function and a very good matching of the canl and canh bus outputs n very high electromagnetic immunity (emi) in normal and low power operating modes n fully integrated receiver ?lters n transmit data (txd) dominant time-out function 2.2 bus failure management n supports single-wire transmission modes with ground offset voltages up to 1.5 v n automatic switching to single-wire mode in the event of bus failures, even when the canh bus wire is short-circuited to v cc n automatic reset to differential mode if bus failure is removed n full wake-up capability during failure modes tja1054 fault-tolerant can transceiver rev. 04 24 september 2009 product data sheet
tja1054_4 ? nxp b.v. 2009. all rights reserved. product data sheet rev. 04 24 september 2009 2 of 25 nxp semiconductors tja1054 fault-tolerant can transceiver 2.3 protections n bus pins short-circuit safe to battery and to ground n thermally protected n bus lines protected against transients in an automotive environment n an unpowered node does not disturb the bus lines 2.4 support for low power modes n low current sleep mode and standby mode with wake-up via the bus lines n power-on reset ?ag on the output 3. quick reference data [1] all parameters are guaranteed over the virtual junction temperature range by design, but only 100 % tested at t amb = 125 c for dies on wafer level, and above this for cased products 100 % tested at t amb =25 c, unless otherwise speci?ed. [2] for bare die, all parameters are only guaranteed if the back side of the die is connected to ground. [3] a local or remote wake-up event will be signalled at the transceiver pins rxd and err if v bat = 5.3 v to 27 v see t ab le 5 . table 1. quick reference data v cc = 4.75 v to 5.25 v; v bat = 5.0 v to 27 v; v stb =v cc ; t vj = - 40 c to +150 c; all voltages are de?ned with respect to ground; positive currents ?ow into the device; unless otherwise speci?ed. [1] [2] symbol parameter conditions min typ max unit v cc supply voltage 4.75 - 5.25 v v bat battery supply voltage on pin bat no time limit - 0.3 - +40 v operating mode [3] 5.0 - 27 v load dump - - 40 v i bat battery supply current on pin bat sleep mode; v cc =0v; v bat =12v -3050 m a v canh voltage on pin canh v cc = 0 v to 5.0 v; v bat 3 0 v; no time limit; with respect to any other pin - 40 - +40 v v canl voltage on pin canl v cc = 0 v to 5.0 v; v bat 3 0 v; no time limit; with respect to any other pin - 40 - +40 v d v canh voltage drop on pin canh i canh = - 40 ma - - 1.4 v d v canl voltage drop on pin canl i canl =40ma - - 1.4 v t pd(l) propagation delay txd (low) to rxd (low) -1- m s t r bus line output rise time between 10 % and 90 %; c1 = 10 nf; see figure 5 - 0.6 - m s t f bus line output fall time between 10 % and 90 %; c1 = 1 nf; see figure 5 - 0.3 - m s t vj virtual junction temperature [4] - 40 - +150 c tja1054_4 ? nxp b.v. 2009. all rights reserved. product data sheet rev. 04 24 september 2009 3 of 25 nxp semiconductors tja1054 fault-tolerant can transceiver [4] junction temperature in accordance with iec 60747-1 . an alternative de?nition is: t vj =t amb +p r th(vj-a) where r th(vj-a) is a ?xed value to be used for the calculation of t vj . the rating for t vj limits the allowable combinations of power dissipation (p) and ambient temperature (t amb ). 4. ordering information 5. block diagram table 2. ordering information type number package name description version tja1054t so14 plastic small outline package; 14 leads; body width 3.9 mm sot108-1 tja1054t/s900 so14 plastic small outline package; 14 leads; body width 3.9 mm sot108-1 tja1054u - bare die; 1990 2700 375 m m- fig 1. block diagram mgl421 failure detector plus wake-up plus time-out wake-up standby control inh 1 wake 7 stb 5 en 6 txd v cc v cc v cc 2 err 4 rxd 3 temperature protection driver receiver bat 14 v cc 10 13 gnd filter timer filter tja1054 9 11 12 8 rtl canh canl rth tja1054_4 ? nxp b.v. 2009. all rights reserved. product data sheet rev. 04 24 september 2009 4 of 25 nxp semiconductors tja1054 fault-tolerant can transceiver 6. pinning information 6.1 pinning 6.2 pin description fig 2. pin con?guration tja1054t inh bat txd gnd rxd canl err canh stb v cc en rtl wake rth 001aaf610 1 2 3 4 5 6 7 8 10 9 12 11 14 13 table 3. pin description symbol pin description inh 1 inhibit output for switching an external voltage regulator if a wake-up signal occurs txd 2 transmit data input for activating the driver to the bus lines rxd 3 receive data output for reading out the data from the bus lines err 4 error, wake-up and power-on indication output; active low in normal operating mode when a bus failure is detected; active low in standby and sleep mode when a wake-up is detected; active low in power-on standby when a v bat power-on event is detected stb 5 standby digital control signal input; together with the input signal on pin en this input determines the state of the transceiver; see t ab le 5 and figure 3 en 6 enable digital control signal input; together with the input signal on pin stb this input determines the state of the transceiver; see t ab le 5 and figure 3 w ake 7 local wake-up signal input (active low); both falling and rising edges are detected rth 8 termination resistor connection; in case of a canh bus wire error the line is terminated with a prede?ned impedance rtl 9 termination resistor connection; in case of a canl bus wire error the line is terminated with a prede?ned impedance v cc 10 supply voltage canh 11 high-level can bus line canl 12 low-level can bus line gnd 13 ground bat 14 battery supply voltage tja1054_4 ? nxp b.v. 2009. all rights reserved. product data sheet rev. 04 24 september 2009 5 of 25 nxp semiconductors tja1054 fault-tolerant can transceiver 7. functional description the tja1054 is the interface between the can protocol controller and the physical wires of the can bus (see figure 7 ). it is primarily intended for low-speed applications, up to 125 kbd, in passenger cars. the device provides differential transmit capability to the can bus and differential receive capability to the can controller. to reduce eme, the rise and fall slopes are limited. this allows the use of an unshielded twisted pair or a parallel pair of wires for the bus lines. moreover, the device supports transmission capability on either bus line if one of the wires is corrupted. the failure detection logic automatically selects a suitable transmission mode. in normal operating mode (no wiring failures) the differential receiver is output on pin rxd (see figure 1 ). the differential receiver inputs are connected to pins canh and canl through integrated ?lters. the ?ltered input signals are also used for the single-wire receivers. the receivers connected to pins canh and canl have threshold voltages that ensure a maximum noise margin in single-wire mode. a timer function (txd dominant time-out function) has been integrated to prevent the bus lines from being driven into a permanent dominant state (thus blocking the entire network communication) due to a situation in which pin txd is permanently forced to a low level, caused by a hardware and/or software application failure. if the duration of the low level on pin txd exceeds a certain time, the transmitter will be disabled. the timer will be reset by a high level on pin txd. 7.1 failure detector the failure detector is fully active in the normal operating mode. after the detection of a single bus failure the detector switches to the appropriate mode (see t ab le 4 ). the differential receiver threshold voltage is set at - 3.2 v typical (v cc = 5 v). this ensures correct reception with a noise margin as high as possible in the normal operating mode and in the event of failures 1, 2, 5 and 6a. these failures, or recovery from them, do not destroy ongoing transmissions. the output drivers remain active, the termination does not change and the receiver remains in differential mode (see t ab le 4 ). failures 3, 3a and 6 are detected by comparators connected to the canh and canl bus lines. failures 3 and 3a are detected in a two-step approach. if the canh bus line exceeds a certain voltage level, the differential comparator signals a continuous dominant condition. because of inter operability reasons with the predecessor products pca82c252 and tja1053, after a ?rst time-out the transceiver switches to single-wire operation through canh. if the canh bus line is still exceeding the canh detection voltage for a second time-out, the tja1054 switches to canl operation; the canh driver is switched off and the rth bias changes to the pull-down current source. the time-outs (delays) are needed to avoid false triggering by external rf ?elds. tja1054_4 ? nxp b.v. 2009. all rights reserved. product data sheet rev. 04 24 september 2009 6 of 25 nxp semiconductors tja1054 fault-tolerant can transceiver [1] a weak termination implies a pull-down current source behavior of 75 m a typical. [2] a weak termination implies a pull-up current source behavior of 75 m a typical. failure 6 is detected if the canl bus line exceeds its comparator threshold for a certain period of time. this delay is needed to avoid false triggering by external rf ?elds. after detection of failure 6, the reception is switched to the single-wire mode through canh; the canl driver is switched off and the rtl bias changes to the pull-up current source. recovery from failures 3, 3a and 6 is detected automatically after reading a consecutive recessive level by corresponding comparators for a certain period of time. failures 4 and 7 initially result in a permanent dominant level on pin rxd. after a time-out the canl driver is switched off and the rtl bias changes to the pull-up current source. reception continues by switching to the single-wire mode via pins canh or canl. when failures 4 or 7 are removed, the recessive bus levels are restored. if the differential voltage remains below the recessive threshold level for a certain period of time, reception and transmission switch back to the differential mode. if any of the wiring failure occurs, the output signal on pin err will be set to low. on error recovery, the output signal on pin err will be set to high again. in case of an interrupted open bus wire, this failure will be detected and signalled only if there is an open wire between the transmitting and receiving node(s). thus, during open wire failures, pin err typically toggles. during all single-wire transmissions, emc performance (both immunity and emission) is worse than in the differential mode. the integrated receiver ?lters suppress any hf noise induced into the bus wires. the cut-off frequency of these ?lters is a compromise between propagation delay and hf suppression. in single-wire mode, lf noise cannot be distinguished from the required signal. table 4. bus failures failure description termination canh (rth) termination canl (rtl) canh driver canl driver receiver mode 1 canh wire interrupted on on on on differential 2 canl wire interrupted on on on on differential 3 canh short-circuited to battery weak [1] on off on canl 3a canh short-circuited to v cc weak [1] on off on canl 4 canl short-circuited to ground on weak [2] on off canh 5 canh short-circuited to ground on on on on differential 6 canl short-circuited to battery on weak [2] on off canh 6a canl short-circuited to v cc on on on on differential 7 canl and canh mutually short-circuited on weak [2] on off canh tja1054_4 ? nxp b.v. 2009. all rights reserved. product data sheet rev. 04 24 september 2009 7 of 25 nxp semiconductors tja1054 fault-tolerant can transceiver 7.2 low power modes the transceiver provides three low power modes which can be entered and exited via stb and en (see t ab le 5 and figure 3 ). the sleep mode is the mode with the lowest power consumption. pin inh is switched to high-impedance for deactivation of the external voltage regulator. pin canl is biased to the battery voltage via pin rtl. if the supply voltage is provided, pins rxd and err will signal the wake-up interrupt. the standby mode operates in the same way as the sleep mode but with a high level on pin inh. the power-on standby mode is the same as the standby mode, however, in this mode the battery power-on ?ag is shown on pin err instead of the wake-up interrupt signal. the output on pin rxd will show the wake-up interrupt. this mode is only for reading out the power-on ?ag. [1] if the supply voltage v cc is present [2] wake-up interrupts are released when entering normal operating mode. [3] a local or remote wake-up event will be signalled at the transceiver pins rxd and err if v bat =5.3vto27v. [4] in case the goto-sleep command was used before. when v cc drops, pin en will become low, but due to the fail-safe functionality this does not effect the internal functions. [5] v bat power-on ?ag will be reset when entering normal operating mode. wake-up requests are recognized by the transceiver through two possible channels: ? the bus lines for remote wake-up ? pin w ake for local wake-up in order to wake-up the transceiver remotely through the bus lines, a ?lter mechanism is integrated. this mechanism makes sure that noise and any present bus failure conditions do not result into an erroneous wake-up. because of this mechanism it is not suf?cient to simply pull the canh or canl bus lines to a dominant level for a certain time. to guarantee a successful remote wake-up under all conditions, a message frame with a dominant phase of at least the maximum speci?ed t (canh) or t (canl) in it is required. table 5. normal operating and low power modes mode pin stb pin en pin err pin rxd pin rtl switched to low high low high goto-sleep command low high wake-up interrupt signal [1] [2] [3] wake-up interrupt signal [1] [2] [3] v bat sleep low low [4] standby low low power-on standby high low v bat power-on ?ag [1] [5] wake-up interrupt signal [1] [2] [3] v bat normal operating high high error ?ag no error ?ag dominant received data recessive received data v cc tja1054_4 ? nxp b.v. 2009. all rights reserved. product data sheet rev. 04 24 september 2009 8 of 25 nxp semiconductors tja1054 fault-tolerant can transceiver a local wake-up through pin w ake is detected by a rising or falling edge with a consecutive level exceeding the maximum speci?ed t wake . on a wake-up request the transceiver will set the output on pin inh to high which can be used to activate the external supply voltage regulator. if v cc is provided the wake-up request can be read on the err or rxd outputs, so the external microcontroller can activate the transceiver (switch to normal operating mode) via pins stb and en. to prevent a false remote wake-up due to transients or rf ?elds, the wake-up voltage levels have to be maintained for a certain period of time. in the low power modes the failure detection circuit remains partly active to prevent an increased power consumption in the event of failures 3, 3a, 4 and 7. to prevent a false local wake-up during an open wire at pin w ake, this pin has a weak pull-up current source towards v bat . however, in order to prevent emc issues, it is recommended to connect a not used pin w ake to pin bat. inh is set to ?oating only if the goto-sleep command is entered successfully. to enter a successful goto-sleep command under all conditions, this command must be kept stable for the maximum speci?ed t h(sleep) . pin inh will be set to a high level again by the following events only: ? v bat power-on (cold start) ? rising or falling edge on pin w ake ? a message frame with a dominant phase of at least the maximum speci?ed t (canh) or t (canl) , while pin en or pin stb is at a low level ? pin stb goes to a high level with v cc active to provide fail-safe functionality, the signals on pins stb and en will internally be set to low when v cc is below a certain threshold voltage (v cc(stb) ). 7.3 power-on after power-on (v bat switched on) the signal on pin inh will become high and an internal power-on ?ag will be set. this ?ag can be read in the power-on standby mode through pin err ( stb = 1; en = 0) and will be reset by entering the normal operating mode. 7.4 protections a current limiting circuit protects the transmitter output stages against short-circuit to positive and negative battery voltage. if the junction temperature exceeds the typical value of 165 c, the transmitter output stages are disabled. because the transmitter is responsible for the major part of the power dissipation, this will result in a reduced power dissipation and hence a lower chip temperature. all other parts of the device will continue to operate. the pins canh and canl are protected against electrical transients which may occur in an automotive environment. tja1054_4 ? nxp b.v. 2009. all rights reserved. product data sheet rev. 04 24 september 2009 9 of 25 nxp semiconductors tja1054 fault-tolerant can transceiver 8. limiting values mode 10 stands for: pin stb = high and pin en = low. (1) mode change via input pins stb and en. (2) mode change via input pins stb and en; it should be noted that in the sleep mode pin inh is inactive and possibly there is no v cc . mode control is only possible if v cc of the transceiver is active. (3) pin inh is activated after wake-up via bus input pin w ake. (4) transitions to normal mode clear the internal wake-up: interrupt and battery fail ?ag are cleared. (5) transitions to sleep mode: pin inh is deactivated. fig 3. mode control mbk949 power-on standby 10 normal (4) 11 goto sleep (5) 01 standby 00 sleep 00 (1) (2) (3) table 6. limiting values in accordance with the absolute maximum rating system (iec 60134). [1] symbol parameter conditions min max unit v cc supply voltage - 0.3 +6 v v bat battery supply voltage - 0.3 +40 v v txd voltage on pin txd - 0.3 v cc + 0.3 v v rxd voltage on pin rxd - 0.3 v cc + 0.3 v v err voltage on pin err - 0.3 v cc + 0.3 v v stb voltage on pin stb - 0.3 v cc + 0.3 v v en voltage on pin en - 0.3 v cc + 0.3 v v canh voltage on pin canh with respect to any other pin - 40 +40 v v canl voltage on pin canl with respect to any other pin - 40 +40 v v trt(n) transient voltage on pins canh and canl see figure 6 - 150 +100 v tja1054_4 ? nxp b.v. 2009. all rights reserved. product data sheet rev. 04 24 september 2009 10 of 25 nxp semiconductors tja1054 fault-tolerant can transceiver [1] all voltages are de?ned with respect to pin gnd, unless otherwise speci?ed. positive current ?ows into the device. [2] only relevant if v wake tja1054_4 ? nxp b.v. 2009. all rights reserved. product data sheet rev. 04 24 september 2009 12 of 25 nxp semiconductors tja1054 fault-tolerant can transceiver pins rxd and err v oh) high-level output voltage on pin err i o = - 100 m av cc - 0.9 - v cc v on pin rxd i o = - 1ma v cc - 0.9 - v cc v v ol low-level output voltage on pin err i o = 1.6 ma 0 - 0.4 v on pin rxd i o = 7.5 ma 0 - 1.5 v pin w ake i il low-level input current v wake =0v; v bat =27v - 10 - 4 - 1 m a v th(wake) wake-up threshold voltage v stb = 0 v 2.5 3.2 3.9 v pin inh d v h high-level voltage drop i inh = - 0.18 ma - - 0.8 v i l leakage current sleep mode; v inh =0v - - 5 m a pins canh and canl v canh voltage on pin canh v cc = 0 v to 5.0 v; v bat 3 0v; no time limit; with respect to any other pin - 40 - +40 v v canl voltage on pin canl v cc = 0 v to 5.0 v; v bat 3 0v; no time limit; with respect to any other pin - 40 - +40 v d v canh voltage drop on pin canh i canh = - 40 ma - - 1.4 v d v canl voltage drop on pin canl i canl =40ma - - 1.4 v v th(dif) differential receiver threshold voltage no failures and bus failures 1, 2, 5 and 6a; see figure 4 v cc =5v - 3.5 - 3.2 - 2.9 v v cc = 4.75 v to 5.25 v - 0.70v cc - 0.64v cc - 0.58v cc v v o(reces) recessive output voltage v txd =v cc on pin canh r rth <4k w - - 0.2 v on pin canl r rtl <4k w v cc - 0.2 - - v v o(dom) dominant output voltage v txd =0v; v en =v cc on pin canh i canh = - 40 ma v cc - 1.4 - - v on pin canl i canl =40ma - - 1.4 v i o(canh) output current on pin canh normal operating mode; v canh =0v; v txd =0v - 110 - 80 - 45 ma low power modes; v canh =0v;v cc =5v - - 0.25 - m a table 8. static characteristics continued v cc = 4.75 v to 5.25 v; v bat = 5.0 v to 27 v; v stb =v cc ; t vj = - 40 c to +150 c; all voltages are de?ned with respect to ground; positive currents ?ow into the device; unless otherwise speci?ed. [1] [2] [3] symbol parameter conditions min typ max unit tja1054_4 ? nxp b.v. 2009. all rights reserved. product data sheet rev. 04 24 september 2009 13 of 25 nxp semiconductors tja1054 fault-tolerant can transceiver i o(canl) output current on pin canl normal operating mode; v canl =14v; v txd =0v 45 70 100 ma low power modes; v canl =12v; v bat =12v -0- m a v d(canh)(sc) detection voltage for short-circuit to battery voltage on pin canh normal operating mode; v cc =5v 1.5 1.7 1.85 v low power modes 1.1 1.8 2.5 v v d(canl)(sc) detection voltage for short-circuit to battery voltage on pin canl normal operating mode v cc = 5 v 6.6 7.2 7.8 v v cc = 4.75 v to 5.25 v 1.32v cc 1.44v cc 1.56v cc v v th(wake) wake-up threshold voltage on pin canl low power modes 2.5 3.2 3.9 v on pin canh low power modes 1.1 1.8 2.5 v d v th(wake) difference of wake-up threshold voltages low power modes 0.8 1.4 - v v th(canh)(sc) single-ended receiver threshold voltage on pin canh normal operating mode and failures 4, 6 and 7 v cc = 5 v 1.5 1.7 1.85 v v cc = 4.75 v to 5.25 v 0.30v cc 0.34v cc 0.37v cc v v th(canl)(sc) single-ended receiver threshold voltage on pin canl normal operating mode and failures 3 and 3a v cc = 5 v 3.15 3.3 3.45 v v cc = 4.75 v to 5.25 v 0.63v cc 0.66v cc 0.69v cc v r i(canh)(sc) single-ended input resistance on pin canh normal operating mode 110 165 270 k w r i(canl)(sc) single-ended input resistance on pin canl normal operating mode 110 165 270 k w r i(dif) differential input resistance normal operating mode 220 330 540 k w pins rth and rtl r sw(rtl) switch-on resistance on pin rtl and v cc normal operating mode; | i o | <10ma - 50 100 w r sw(rth) switch-on resistance on pin rth and ground normal operating mode; | i o | <10ma - 50 100 w v o(rth) output voltage on pin rth low power modes; i o = 1 ma - 0.7 1.0 v i o(rtl) output current on pin rtl low power modes; v rtl =0v - 1.25 - 0.65 - 0.3 ma i pu(rtl) pull-up current on pin rtl normal operating mode and failures 4, 6 and 7 -75- m a table 8. static characteristics continued v cc = 4.75 v to 5.25 v; v bat = 5.0 v to 27 v; v stb =v cc ; t vj = - 40 c to +150 c; all voltages are de?ned with respect to ground; positive currents ?ow into the device; unless otherwise speci?ed. [1] [2] [3] symbol parameter conditions min typ max unit tja1054_4 ? nxp b.v. 2009. all rights reserved. product data sheet rev. 04 24 september 2009 14 of 25 nxp semiconductors tja1054 fault-tolerant can transceiver [1] all parameters are guaranteed over the virtual junction temperature range by design, but only 100 % tested at t amb = 125 c for dies on wafer level, and above this for cased products 100 % tested at t amb =25 c, unless otherwise speci?ed. [2] for bare die, all parameters are only guaranteed if the back side of the die is connected to ground. [3] a local or remote wake-up event will be signalled at the transceiver pins rxd and err if v bat = 5.3 v to 27 v (see t ab le 5 ). 11. dynamic characteristics i pd(rth) pull-down current on pin rth normal operating mode and failures 3 and 3a -75- m a thermal shutdown t j(sd) shutdown junction temperature 155 165 180 c table 8. static characteristics continued v cc = 4.75 v to 5.25 v; v bat = 5.0 v to 27 v; v stb =v cc ; t vj = - 40 c to +150 c; all voltages are de?ned with respect to ground; positive currents ?ow into the device; unless otherwise speci?ed. [1] [2] [3] symbol parameter conditions min typ max unit table 9. dynamic characteristics v cc = 4.75 v to 5.25 v; v bat = 5.0 v to 27 v; v stb =v cc ; t vj = - 40 c to +150 c; all voltages are de?ned with respect to ground; unless otherwise speci?ed. [1] [2] [3] symbol parameter conditions min typ max unit t t(r-d) transition time for recessive to dominant (on pins canl and canh) between 10 % and 90 %; r1 = 100 w ; c1 = 10 nf; c2 = not present; see figure 5 0.35 0.65 - m s t t(d-r)) transition time for dominant to recessive (on pins canl and canh) between 10 % and 90 %; r1 = 100 w ; c1 = 10 nf; c2 = not present; see figure 5 0.2 0.3 - m s t pd(l) propagation delay txd (low) to rxd (low) no failures and failures 1, 2, 5 and 6a; r1 = 100 w ; see figure 4 and figure 5 c1 = 1 nf; c2 = not present - 0.75 1.5 m s c1 = c2 = 3.3 nf - 1 1.75 m s failures 3, 3a, 4, 6 and 7; r1 = 100 w ; see figure 4 and figure 5 c1 = 1 nf; c2 = not present - 0.85 1.4 m s c1 = c2 = 3.3 nf - 1.1 1.7 m s t pd(h) propagation delay txd (high) to rxd (high) no failures and failures 1, 2, 5 and 6a; r1 = 100 w ; see figure 4 and figure 5 c1 = 1 nf; c2 = not present - 1.2 1.9 m s c1 = c2 = 3.3 nf - 2.5 3.3 m s failures 3, 3a, 4, 6 and 7; r1 = 100 w ; see figure 4 and figure 5 c1 = 1 nf; c2 = not present - 1.1 1.7 m s c1 = c2 = 3.3 nf - 1.5 2.2 m s t r bus line output rise time between 10 % and 90 %; c1 = 10 nf; see figure 5 - 0.6 - m s t f bus line output fall time between 10 % and 90 %; c1 = 1 nf; see figure 5 - 0.3 - m s t react(sleep) reaction time of goto sleep command [4] 5- 50 m s tja1054_4 ? nxp b.v. 2009. all rights reserved. product data sheet rev. 04 24 september 2009 15 of 25 nxp semiconductors tja1054 fault-tolerant can transceiver [1] all parameters are guaranteed over the virtual junction temperature range by design, but only 100 % tested at t amb = 125 c for dies on wafer level, and above this for cased products 100 % tested at t amb =25 c, unless otherwise speci?ed. [2] for bare die, all parameters are only guaranteed if the back side of the die is connected to ground. [3] a local or remote wake-up event will be signalled at the transceiver pins rxd and err if v bat = 5.3 v to 27 v (see t ab le 5 ). [4] to guarantee a successful mode transition under all conditions, the maximum speci?ed time must be applied. t dis(txd) disable time of txd permanent dominant timer normal operating mode; v txd = 0 v 0.75 - 4 ms t canh dominant time for remote wake-up on pin canh low power modes; v bat =12v [4] 7- 38 m s t canl dominant time for remote wake-up on pin canl low power modes; v bat =12v [4] 7- 38 m s t wake required time on pin w ake for local wake-up low power modes; v bat =12v; for wake-up after receiving a falling or rising edge [4] 7- 38 m s t det failure detection time normal operating mode failures 3 and 3a 1.6 - 8.0 ms failures 4, 6 and 7 0.3 - 1.6 ms low power modes; v bat =12v failures 3 and 3a 1.6 - 8.0 ms failures 4 and 7 0.1 - 1.6 ms t rec failure recovery time normal operating mode failures 3 and 3a 0.3 - 1.6 ms failures 4 and 7 7 - 38 m s failure 6 125 - 750 m s low power modes; v bat =12v failures 3, 3a, 4 and 7 0.3 - 1.6 ms n det pulse-count difference between canh and canl for failure detection normal operating mode and failures 1, 2, 5 and 6a; pin err becomes low -4 - n rec number of consecutive pulses on canh and canl simultaneously for failure recovery failures 1, 2, 5 and 6a - 4 - table 9. dynamic characteristics continued v cc = 4.75 v to 5.25 v; v bat = 5.0 v to 27 v; v stb =v cc ; t vj = - 40 c to +150 c; all voltages are de?ned with respect to ground; unless otherwise speci?ed. [1] [2] [3] symbol parameter conditions min typ max unit tja1054_4 ? nxp b.v. 2009. all rights reserved. product data sheet rev. 04 24 september 2009 16 of 25 nxp semiconductors tja1054 fault-tolerant can transceiver 12. test information v diff =v canh - v canl fig 4. timing diagram for dynamic characteristics mgl424 - 5 v - 3.2 v 2.2 v 0.7v cc 0.3v cc 0 v 5 v 1.4 v 3.6 v 0 v 2 v to v c c v txd v canl v canh d v can v rxd t pd(l) t pd(h) termination resistors r1 (100 w ) are not connected to pin rth or pin rtl for testing purposes because the minimum load allowed on the can bus lines is 500 w per transceiver. the capacitive bus load of 10 nf is split into 3 equal capacitors (3.3 nf) to simulate the bus cable. fig 5. test circuit for dynamic characteristics mgl423 20 pf rxd en stb txd wake 7 2 5 6 3 inh bat v cc 11410 gnd err 13 4 rtl rth 8 9 canl 12 canh 11 + 5 v r1 c1 c2 r1 c1 tja1054 tja1054_4 ? nxp b.v. 2009. all rights reserved. product data sheet rev. 04 24 september 2009 17 of 25 nxp semiconductors tja1054 fault-tolerant can transceiver 12.1 quality information this product has been quali?ed to the appropriate automotive electronics council (aec) standard q100 or q101 and is suitable for use in automotive applications. the waveforms of the applied transients on pins canh and canl will be in accordance with iso 7637 part 1: test pulses 1, 2, 3a and 3b. fig 6. test circuit for automotive transients mgl426 20 pf rxd en stb txd wake 7 2 5 6 3 inh bat v cc 11410 gnd err 13 4 rtl rth 8 9 canl 12 canh 11 + 5 v + 12 v 1 nf 10 m f generator 1 nf 1 nf 1 nf 125 w 125 w 511 w 511 w tja1054 fig 7. application diagram mgl425 100 nf txd rxd stb err en inh 2 7 35461 tja1054 can transceiver bat v cc v dd gnd 14 10 13 wake p8xc592/p8xce598 can controller ctx0 crxo px.x px.x px.x 811129 rtl canl canh rth can bus line +5 v +5 v battery v bat tja1054_4 ? nxp b.v. 2009. all rights reserved. product data sheet rev. 04 24 september 2009 18 of 25 nxp semiconductors tja1054 fault-tolerant can transceiver 13. bare die information [1] all coordinates ( m m) represent the position of the center of each pad with respect to the bottom left-hand corner of the top aluminium layer (see figure 8 ). table 10. bonding pad locations symbol pad coordinates [1] x y inh 1 106 317 txd 2 111 169 rxd 3 750 111 err 4 1347 111 stb 5 2248 103 en 6 2521 240 w ake 7 2521 381 rth 8 2550 1269 rtl 9 2359 1840 v cc 10 1886 1809 canh 11 872 1840 canl 12 437 1840 gnd 13a 80 1356 gnd 13b 80 1241 bat 14 106 772 fig 8. bonding pad locations tja1054u 1 2 3 4 5 6 7 8 9 10 11 12 14 13 a 13 b mgw505 y 2700 m m x 0 0 1990 m m tja1054_4 ? nxp b.v. 2009. all rights reserved. product data sheet rev. 04 24 september 2009 19 of 25 nxp semiconductors tja1054 fault-tolerant can transceiver 14. package outline fig 9. package outline sot108-1 (so14) unit a max. a 1 a 2 a 3 b p cd (1) e (1) (1) eh e ll p qz y w v q references outline version european projection issue date iec jedec jeita mm inches 1.75 0.25 0.10 1.45 1.25 0.25 0.49 0.36 0.25 0.19 8.75 8.55 4.0 3.8 1.27 6.2 5.8 0.7 0.6 0.7 0.3 8 0 o o 0.25 0.1 dimensions (inch dimensions are derived from the original mm dimensions) note 1. plastic or metal protrusions of 0.15 mm (0.006 inch) maximum per side are not included. 1.0 0.4 sot108-1 x w m q a a 1 a 2 b p d h e l p q detail x e z e c l v m a (a ) 3 a 7 8 1 14 y 076e06 ms-012 pin 1 index 0.069 0.010 0.004 0.057 0.049 0.01 0.019 0.014 0.0100 0.0075 0.35 0.34 0.16 0.15 0.05 1.05 0.041 0.244 0.228 0.028 0.024 0.028 0.012 0.01 0.25 0.01 0.004 0.039 0.016 99-12-27 03-02-19 0 2.5 5 mm scale so14: plastic small outline package; 14 leads; body width 3.9 mm sot108-1 tja1054_4 ? nxp b.v. 2009. all rights reserved. product data sheet rev. 04 24 september 2009 20 of 25 nxp semiconductors tja1054 fault-tolerant can transceiver 15. soldering of smd packages this text provides a very brief insight into a complex technology. a more in-depth account of soldering ics can be found in application note an10365 surface mount re?ow soldering description . 15.1 introduction to soldering soldering is one of the most common methods through which packages are attached to printed circuit boards (pcbs), to form electrical circuits. the soldered joint provides both the mechanical and the electrical connection. there is no single soldering method that is ideal for all ic packages. wave soldering is often preferred when through-hole and surface mount devices (smds) are mixed on one printed wiring board; however, it is not suitable for ?ne pitch smds. re?ow soldering is ideal for the small pitches and high densities that come with increased miniaturization. 15.2 wave and re?ow soldering wave soldering is a joining technology in which the joints are made by solder coming from a standing wave of liquid solder. the wave soldering process is suitable for the following: ? through-hole components ? leaded or leadless smds, which are glued to the surface of the printed circuit board not all smds can be wave soldered. packages with solder balls, and some leadless packages which have solder lands underneath the body, cannot be wave soldered. also, leaded smds with leads having a pitch smaller than ~0.6 mm cannot be wave soldered, due to an increased probability of bridging. the re?ow soldering process involves applying solder paste to a board, followed by component placement and exposure to a temperature pro?le. leaded packages, packages with solder balls, and leadless packages are all re?ow solderable. key characteristics in both wave and re?ow soldering are: ? board speci?cations, including the board ?nish, solder masks and vias ? package footprints, including solder thieves and orientation ? the moisture sensitivity level of the packages ? package placement ? inspection and repair ? lead-free soldering versus snpb soldering 15.3 wave soldering key characteristics in wave soldering are: ? process issues, such as application of adhesive and ?ux, clinching of leads, board transport, the solder wave parameters, and the time during which components are exposed to the wave ? solder bath speci?cations, including temperature and impurities tja1054_4 ? nxp b.v. 2009. all rights reserved. product data sheet rev. 04 24 september 2009 21 of 25 nxp semiconductors tja1054 fault-tolerant can transceiver 15.4 re?ow soldering key characteristics in re?ow soldering are: ? lead-free versus snpb soldering; note that a lead-free re?ow process usually leads to higher minimum peak temperatures (see figure 10 ) than a snpb process, thus reducing the process window ? solder paste printing issues including smearing, release, and adjusting the process window for a mix of large and small components on one board ? re?ow temperature pro?le; this pro?le includes preheat, re?ow (in which the board is heated to the peak temperature) and cooling down. it is imperative that the peak temperature is high enough for the solder to make reliable solder joints (a solder paste characteristic). in addition, the peak temperature must be low enough that the packages and/or boards are not damaged. the peak temperature of the package depends on package thickness and volume and is classi?ed in accordance with t ab le 11 and 12 moisture sensitivity precautions, as indicated on the packing, must be respected at all times. studies have shown that small packages reach higher temperatures during re?ow soldering, see figure 10 . table 11. snpb eutectic process (from j-std-020c) package thickness (mm) package re?ow temperature ( c) volume (mm 3 ) < 350 3 350 < 2.5 235 220 3 2.5 220 220 table 12. lead-free process (from j-std-020c) package thickness (mm) package re?ow temperature ( c) volume (mm 3 ) < 350 350 to 2000 > 2000 < 1.6 260 260 260 1.6 to 2.5 260 250 245 > 2.5 250 245 245 tja1054_4 ? nxp b.v. 2009. all rights reserved. product data sheet rev. 04 24 september 2009 22 of 25 nxp semiconductors tja1054 fault-tolerant can transceiver for further information on temperature pro?les, refer to application note an10365 surface mount re?ow soldering description . 16. revision history msl: moisture sensitivity level fig 10. temperature pro?les for large and small components 001aac844 temperature time minimum peak temperature = minimum soldering temperature maximum peak temperature = msl limit, damage level peak temperature table 13. revision history document id release date data sheet status change notice supersedes tja1054_4 20090924 product data sheet - tja1054_3 modi?cations: ? the format of this data sheet has been redesigned to comply with the new identity guidelines of nxp semiconductors. ? legal texts have been adapted to the new company name where appropriate. ? value of parameter v esd (machine model) changed in t ab le 6 . tja1054_3 (9397 750 11721) 20040323 product speci?cation - tja1054_2 tja1054_2 (9397 750 08965) 20011120 product speci?cation - tja1054_1 tja1054_1 (9397 750 03636) 19990211 preliminary speci?cation - - tja1054_4 ? nxp b.v. 2009. all rights reserved. product data sheet rev. 04 24 september 2009 23 of 25 nxp semiconductors tja1054 fault-tolerant can transceiver 17. legal information 17.1 data sheet status [1] please consult the most recently issued document before initiating or completing a design. [2] the term short data sheet is explained in section de?nitions. [3] the product status of device(s) described in this document may have changed since this document was published and may differ in case of multiple dev ices. the latest product status information is available on the internet at url http://www .nxp .com . 17.2 de?nitions draft the document is a draft version only. the content is still under internal review and subject to formal approval, which may result in modi?cations or additions. nxp semiconductors does not give any representations or warranties as to the accuracy or completeness of information included herein and shall have no liability for the consequences of use of such information. short data sheet a short data sheet is an extract from a full data sheet with the same product type number(s) and title. a short data sheet is intended for quick reference only and should not be relied upon to contain detailed and full information. for detailed and full information see the relevant full data sheet, which is available on request via the local nxp semiconductors sales of?ce. in case of any inconsistency or con?ict with the short data sheet, the full data sheet shall prevail. 17.3 disclaimers general information in this document is believed to be accurate and reliable. however, nxp semiconductors does not give any representations or warranties, expressed or implied, as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. right to make changes nxp semiconductors reserves the right to make changes to information published in this document, including without limitation speci?cations and product descriptions, at any time and without notice. this document supersedes and replaces all information supplied prior to the publication hereof. suitability for use nxp semiconductors products are not designed, authorized or warranted to be suitable for use in medical, military, aircraft, space or life support equipment, nor in applications where failure or malfunction of an nxp semiconductors product can reasonably be expected to result in personal injury, death or severe property or environmental damage. nxp semiconductors accepts no liability for inclusion and/or use of nxp semiconductors products in such equipment or applications and therefore such inclusion and/or use is at the customers own risk. applications applications that are described herein for any of these products are for illustrative purposes only. nxp semiconductors makes no representation or warranty that such applications will be suitable for the speci?ed use without further testing or modi?cation. limiting values stress above one or more limiting values (as de?ned in the absolute maximum ratings system of iec 60134) may cause permanent damage to the device. limiting values are stress ratings only and operation of the device at these or any other conditions above those given in the characteristics sections of this document is not implied. exposure to limiting values for extended periods may affect device reliability. terms and conditions of sale nxp semiconductors products are sold subject to the general terms and conditions of commercial sale, as published at http://www .nxp .com/pro? le/ter ms , including those pertaining to warranty, intellectual property rights infringement and limitation of liability, unless explicitly otherwise agreed to in writing by nxp semiconductors. in case of any inconsistency or con?ict between information in this document and such terms and conditions, the latter will prevail. no offer to sell or license nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights. export control this document as well as the item(s) described herein may be subject to export control regulations. export might require a prior authorization from national authorities. bare die all die are tested on compliance with their related technical speci?cations as stated in this data sheet up to the point of wafer sawing and are handled in accordance with the nxp semiconductors storage and transportation conditions. if there are data sheet limits not guaranteed, these will be separately indicated in the data sheet. there are no post-packing tests performed on individual die or wafers. nxp semiconductors has no control of third party procedures in the sawing, handling, packing or assembly of the die. accordingly, nxp semiconductors assumes no liability for device functionality or performance of the die or systems after third party sawing, handling, packing or assembly of the die. it is the responsibility of the customer to test and qualify their application in which the die is used. all die sales are conditioned upon and subject to the customer entering into a written die sale agreement with nxp semiconductors through its legal department. quick reference data the quick reference data is an extract of the product data given in the limiting values and characteristics sections of this document, and as such is not complete, exhaustive or legally binding. 17.4 trademarks notice: all referenced brands, product names, service names and trademarks are the property of their respective owners. document status [1] [2] product status [3] de?nition objective [short] data sheet development this document contains data from the objective speci?cation for product development. preliminary [short] data sheet quali?cation this document contains data from the preliminary speci?cation. product [short] data sheet production this document contains the product speci?cation. tja1054_4 ? nxp b.v. 2009. all rights reserved. product data sheet rev. 04 24 september 2009 24 of 25 nxp semiconductors tja1054 fault-tolerant can transceiver 18. contact information for more information, please visit: http://www .nxp.com for sales of?ce addresses, please send an email to: salesad dresses@nxp.com nxp semiconductors tja1054 fault-tolerant can transceiver ? nxp b.v. 2009. all rights reserved. for more information, please visit: http://www.nxp.com for sales office addresses, please send an email to: salesaddresses@nxp.com date of release: 24 september 2009 document identifier: tja1054_4 please be aware that important notices concerning this document and the product(s) described herein, have been included in section legal information. 19. contents 1 general description . . . . . . . . . . . . . . . . . . . . . . 1 2 features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1 2.1 optimized for in-car low-speed communication 1 2.2 bus failure management. . . . . . . . . . . . . . . . . . 1 2.3 protections . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2 2.4 support for low power modes . . . . . . . . . . . . . . 2 3 quick reference data . . . . . . . . . . . . . . . . . . . . . 2 4 ordering information . . . . . . . . . . . . . . . . . . . . . 3 5 block diagram . . . . . . . . . . . . . . . . . . . . . . . . . . 3 6 pinning information . . . . . . . . . . . . . . . . . . . . . . 4 6.1 pinning . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4 6.2 pin description . . . . . . . . . . . . . . . . . . . . . . . . . 4 7 functional description . . . . . . . . . . . . . . . . . . . 5 7.1 failure detector . . . . . . . . . . . . . . . . . . . . . . . . . 5 7.2 low power modes. . . . . . . . . . . . . . . . . . . . . . . 7 7.3 power-on. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8 7.4 protections . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8 8 limiting values. . . . . . . . . . . . . . . . . . . . . . . . . . 9 9 thermal characteristics. . . . . . . . . . . . . . . . . . 10 10 static characteristics. . . . . . . . . . . . . . . . . . . . 11 11 dynamic characteristics . . . . . . . . . . . . . . . . . 14 12 test information . . . . . . . . . . . . . . . . . . . . . . . . 16 12.1 quality information . . . . . . . . . . . . . . . . . . . . . 17 13 bare die information . . . . . . . . . . . . . . . . . . . . 18 14 package outline . . . . . . . . . . . . . . . . . . . . . . . . 19 15 soldering of smd packages . . . . . . . . . . . . . . 20 15.1 introduction to soldering . . . . . . . . . . . . . . . . . 20 15.2 wave and re?ow soldering . . . . . . . . . . . . . . . 20 15.3 wave soldering . . . . . . . . . . . . . . . . . . . . . . . . 20 15.4 re?ow soldering . . . . . . . . . . . . . . . . . . . . . . . 21 16 revision history . . . . . . . . . . . . . . . . . . . . . . . . 22 17 legal information. . . . . . . . . . . . . . . . . . . . . . . 23 17.1 data sheet status . . . . . . . . . . . . . . . . . . . . . . 23 17.2 de?nitions . . . . . . . . . . . . . . . . . . . . . . . . . . . . 23 17.3 disclaimers . . . . . . . . . . . . . . . . . . . . . . . . . . . 23 17.4 trademarks . . . . . . . . . . . . . . . . . . . . . . . . . . . 23 18 contact information. . . . . . . . . . . . . . . . . . . . . 24 19 contents . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 25 home a bout nxp news careers investors order/bu y support contact m y .nxp the tja1054 is the interface between the prot ocol controller and the physical bus wires in a controller area network (can). it is primarily intended for low-speed applications up to 125 kbd in passenger cars . the device provides differential receive and transmit capa bility but will switch to single-wire transmitter and/or receiver in error conditions. the tja1054t is pin and downwards compatible with the pca82c252t and the tja1053t. this means that these tw o devices can be rep laced by the tja1054t with retention of all functions. the most important improvements of the tja1054 with respect to the pca82c252 and tja1053 are: very low eme due to a very good matchi ng of the canl and canh output signals good emi, especially in low power modes full wake-up capability during bus failures extended bus failure management including short-circuit of the canh bus line to v cc support for easy system fault diagnosis two-edge sensitive wake-up input signal via pin wake optimized for in-car low-speed communication baud rate up to 125 kbd up to 32 nodes can be connected supports unshielded bus wires very low electromagnetic emission (eme) due to built-in slope c ontrol function and a very good matching of the canl and canh bu s outputs very high electromagnetic immunity (emi ) in normal and low power operating modes fully integrated receiver filters transmit data (txd) dominant time-out function bus failure management supports single-wire transmission modes with ground offset voltages up to 1.5 v automatic switching to single-wire mode in the event of bus fa ilures, even when the canh bus wire is short-circuited to v cc automatic reset to differential mode if bus failure is removed full wake-up capability during failure modes protections bus pins short-circuit safe to battery and to ground thermally protected bus lines protected against transi ents in an automotive environment an unpowered node does not disturb the bus lines support for low power modes low current sleep mode and standby mode with wake-up via the bus lines power-on reset flag on the output the variants in the table below are discontinued. see the table discontinued information for more information. see the answers to faq's on certain fields of interest find nxp's equivalent of a competitor's part number view case studies on general applications or technologies request contact with a technical expert find more information on nxp's vision find out more about our ordering process receive e-news on specific interest areas datasheet download datasheet download all documentation tja1054 (product specification) 24-sep-09, 25 pages, 138kb tja1054 - fault-tolerant can transceiver a ll information hereunder is sub j ect to the subsequent disclaimers general description features products/packages quality/reliability/chemical content pricing/ordering/availability samples discontinued information applications block diagrams/pinning design support parametrics/similar products print/email disclaimers general description hide back to top features hide back to top products/packages hide type number orderable part number ordering code (12nc) product status package packing marking eccn tja1054t/s900/vm tja1054t/s900/vm:5 9352 879 79512 volume production sot108 tube dry pack standard marking tja1054t/s900/vm tja1054t/s900/vm,5 9352 879 79518 volume production sot108 reel dry pack, smd, 13" standard marking tja1054t/vm tja1054t/vm,512 9352 879 81512 volume production sot108 tube dry pack standard marking tja1054t/vm tja1054t/vm,518 9352 879 81518 volume production sot108 reel dry pack, smd, 13" standard marking type number orderable part number ordering c ode (12nc) product status package packing marking eccn tja1054t/n1 tja1054t/n1,512 9352 615 12512 discontinued replacement product sot108 tube dry pack standard marking tja1054t/n1 tja1054t/n1,518 9352 615 12518 discontinued replacement product sot108 reel dry pack, smd, 13" standard marking tja1054t/s900 tja1054t/s900,512 9352 832 38512 discontinued replacement product sot108 tube dry pack standard marking tja1054t/s900 tja1054t/s900,518 9352 832 38518 discontinued replacement product sot108 reel dry pack, smd, 13" standard marking tja1054u/n1 tja1054u/n1,005 9352 615 11005 discontinued replacement product uncased die chips on wafer, pre-sawn, on ffc no marking tja1054u/n1 tja1054u/n1,027 9352 615 11027 discontinued replacement product uncased die circuit element packed on reel 7" no marking see also tja1054 preview product information selection guide applications looking for products ... fault-tolerant can transceivers tja1054t select site: english type search here search advanced search / selection guides pa g e 1 of 3 tja1054 - fault-tolerant can tr ansceiver from nxp semiconductors 23-oc t -2009 http://www.nxp.com/ the variants in the table below are discontinued. see the table discontinued information for more information. quality and reliability disclaimer application notes ah_ftcan3_1;fault-tolerant can transceiver (2001-12-20) ah_ftcan3_1;fault-tolerant can transceiver (2001-12-20) an00094_3;tja1041/1041a high speed can transceiver (2006-11-08) support documents 75016161; nxp automotive networking solutions (2007-09-01) 75015743; proven performance ensures automot ive applications can always communicate (2006-09-01) 75015741; the vital link in the interconnected car (2006-09-01) back to top quality/reliability/chemical content hide type number orderable part number chemical content r ohs leadfree conversion date rhf ifr (fit) mtbf (hours) msl tja1054t/s900/vm tja1054t/s900/vm:5 tja1054t_s900_vm always pb-free tja1054t/s900/vm tja1054t/s900/vm,5 tja1054t_s900_vm always pb-free tja1054t/vm tja1054t/vm,512 tja1054t_vm always pb-free tja1054t/vm tja1054t/vm,518 tja1054t_vm always pb-free type number orderable part number chemical content r ohs leadfree conversion date rhf ifr (fit) mtbf (hours) msl tja1054t/n1 tja1054t/n1,512 tja1054t_n1 always pb-free tja1054t/n1 tja1054t/n1,518 tja1054t_n1 always pb-free tja1054t/s900 tja1054t/s900,512 not available always pb-free tja1054t/s900 tja1054t/s900,518 not available always pb-free tja1054u/n1 tja1054u/n1,005 tja1054u_n1 tja1054u/n1 tja1054u/n1,027 tja1054u_n1 back to top pricing/ordering/availability hide type number ordering code (12nc) orderable part number indicative price/unit($) region distributor in stock order quantity inventory date buy online samples tja1054t/s900/vm 9352 879 79512 tja1054t/s900/vm:5 not available tja1054t/s900/vm 9352 879 79518 tja1054t/s900/vm,5 order samples tja1054t/vm 9352 879 81512 tja1054t/vm,512 na future electronics 1,140 10/21/2009 buy online not available tja1054t/vm 9352 879 81518 tja1054t/vm,518 na future electronics 2,500 10/21/2009 buy online order samples back to top discontinued information hide type number ordering code (12nc) last- time buy date last-time delivery date replacement product dn notice status comments tja1054t/n1 935261512512 31-dec- 09 31-mrt-11 tja1054t/vm dn 64 sole source product limited availability (check with your usual sales contact) fab icn5 closure. refer to pcn200901054a dated january 21, 2009. extended last time delivery till 31.3.2011. replacement type with new diffusion fab location only tja1054t/n1 935261512518 31-dec- 09 31-mrt-11 tja1054t/vm dn 64 sole source product limited availability (check with your usual sales contact) fab icn5 closure. refer to pcn200901054a dated january 21, 2009. extended last time delivery till 31.3.2011. replacement type with new diffusion fab location only tja1054t/s900 935283238512 31-dec- 09 31-mrt-11 tja1054t/s900vm dn 64 sole source product limited availability (check with your usual sales contact) fab icn5 closure. refer to pcn200901054a dated january 21, 2009. extended last time delivery till 31.3.2011. replacement type with new diffusion fab location only tja1054t/s900 935283238518 31-dec- 09 31-mrt-11 tja1054t/s900vm dn 64 sole source product limited availability (check with your usual sales contact) fab icn5 closure. refer to pcn200901054a dated january 21, 2009. extended last time delivery till 31.3.2011. replacement type with new diffusion fab location only tja1054u/n1 935261511005 31-dec- 09 30-jun-10 none dn 64 sole source product limited availability (check with your usual sales contact) type number fully withdrawn limited availability. fab icn5 closure. refer to pcn200901054a dated january 21, 2009. tja1054u/n1 935261511027 31-dec- 09 30-jun-10 none dn 64 sole source product limited availability (check with your usual sales contact) type number fully withdrawn limited availability. fab icn5 closure. refer to pcn200901054a dated january 21, 2009. back to top desi g n support hide back to top pa g e 2 of 3 tja1054 - fault-tolerant can tr ansceiver from nxp semiconductors 23-oc t -2009 http://www.nxp.com/ similar products tja1054 links to the similar products page containing an overview of products that are similar in function or related to the type numb er(s) as listed on this page. the similar products page includes products from the same catalog tree(s), relevant se lection guides and products from the same functional category. email this product information print this product information general product disclaimer quality and reliability disclaimer parametrics/similar products hide type number package supply voltage (v) application configuration category features function operating temp. (cel) no. of pins package material transceiver type tja1054t/n1 sot108 5 control devices ft-can transceiver iso11898-3 compliant transceivers -40 ~ +125 14 so14 fault-tolerant can transceivers tja1054u/n1 uncased die 5 control devices ft-can transceiver iso11898-3 compliant transceivers -40 ~ +125 14 so14 fault-tolerant can transceivers back to top print/email hide back to top disclaimers hide nxp | privacy policy | terms of use | sitemap | switch to classic mode ?2006-2009 nxp semiconductors. all rights reserved. pa g e 3 of 3 tja1054 - fault-tolerant can tr ansceiver from nxp semiconductors 23-oc t -2009 http://www.nxp.com/ |
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